RESIN COMPOSITION

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United States of America Patent

SERIAL NO

15408738

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Abstract

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A resin composition that has an excellent balance between thermal creep resistance and toughness and from which a molded product with favorable appearance can be obtained is provided. The resin composition includes: 100 parts by mass in total of (A) polypropylene-based resin and (B) polyphenylene ether resin; 1 parts to 20 parts by mass of (C) an admixture; and 0.01 parts to 0.5 parts by mass of (D) one or more compounds selected from the group consisting of a higher fatty acid, a higher fatty acid metal salt, and a higher fatty acid ester, wherein when the resin composition is dissolved in chloroform, a proportion XD(B+C) of the component (D) present in a whole fraction of 100 mass % dissolved in the chloroform is 0.13 mass % to 0.80 mass %.

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Patent Owner(s)

Patent OwnerAddress
ASAHI KASEI KABUSHIKI KAISHAOSAKA JAPAN OSAKA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
INAGAKI, Nozomi Tokyo, JP 15 11
YAMAMOTO, Mihoko Tokyo, JP 23 88

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