RESIN FILLING METHOD

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United States of America Patent

SERIAL NO

15561797

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A resin filling method that includes the steps of filling in a filling step the filling clearance with the molten resin pressurized by the pressurizing unit, through the first flow path and the second flow path, with the laminated core being held between the flow path plate in contact with the upper mold and the lower mold; moving the upper mold and the pressurizing unit up with respect to the flow path plate to create a space between the upper mold and the flow path plate; removing residual resin in a resin removing step remaining in the second flow path in the flow path plate, with the flow path plate being located on the laminated core; and moving in a core removing step the flow path plate up from the laminated core and then removing the laminated core from the lower mold.

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Patent Owner(s)

Patent OwnerAddress
AISIN AW CO LTDAICHI AICHI

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KORI, Motoki Anjo, JP 7 3

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