LAMINATION MOLDING APPARATUS
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Mar 1, 2018
app pub date -
Aug 2, 2017
filing date -
Sep 1, 2016
priority date (Note) -
Published
status (Latency Note)
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Abstract
A lamination molding apparatus includes a chamber, covering at least a molding area which is the maximum range in which a three-dimensional object can be produced; a molding table, disposed in the molding area in the chamber, on which material powder layers are formed by uniformly spread material powder for each of divided layers, wherein the divided layers are obtained by dividing a desired three-dimensional object for each of a specific thickness; a powder holding wall, surrounding the molding table and holding the material powder supplied onto the molding table; a laser irradiation device, forming sintered layers by irradiating laser beam on specific irradiation areas defined by the contour shape of the desired three-dimensional object of the divided layers on the material powder layers; and a numerical control device, determining, at least before sintering, whether the irradiation areas of all the divided layers are included in the molding area.
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
SODICK CO LTD | 3-12-1 NAKAMACHIDAI TSUZUKI-KU YOKOHAMA KANAGAWA 224-8522 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
ICHIJO, Tsukasa | Kanagawa, JP | 2 | 5 |
# of filed Patents : 2 Total Citations : 5 |
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