STACKABLE MOLDED PACKAGES AND METHODS OF MANUFACTURE THEREOF
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United States of America Patent
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Issued Date -
Feb 22, 2018
app pub date -
Aug 16, 2016
filing date -
Aug 16, 2016
priority date (Note) -
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Abstract
A stackable package assembly and method of manufacturing is provided. The method includes attaching a plurality of interconnect balls to a first surface of a substrate, and encapsulating the first surface of the substrate and the plurality of interconnect balls with an encapsulant. A trench is formed in a first surface of the encapsulant exposing a portion the interconnect balls. An interposer is provided having a first interconnect layer. An assembly is formed by attaching connection sites of a first interconnect layer to the exposed portion of the interconnect balls, the first surface of the second substrate extending into the trench.
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