Measurement of multiple patterning parameters
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United States of America Patent
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Issued Date -
Feb 22, 2018
app pub date -
Oct 15, 2017
filing date -
Dec 23, 2013
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Published
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Abstract
Methods and systems for evaluating the performance of multiple patterning processes are presented. Patterned structures are measured and one or more parameter values characterizing geometric errors induced by the multiple patterning process are determined. In some examples, a single patterned target and a multiple patterned target are measured, the collected data fit to a combined measurement model, and the value of a structural parameter indicative of a geometric error induced by the multiple patterning process is determined based on the fit. In some other examples, light having a diffraction order different from zero is collected and analyzed to determine the value of a structural parameter that is indicative of a geometric error induced by a multiple patterning process. In some embodiments, a single diffraction order different from zero is collected. In some examples, a metrology target is designed to enhance light diffracted at an order different from zero.

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Patent Owner(s)
Patent Owner | Address | |
---|---|---|
KLA-TENCOR CORPORATION | ONE TECHNOLOGY DRIVE MILPITAS CA 95035 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Dziura, Thaddeus Gerard | San Jose, US | 21 | 486 |
Krishnan, Shankar | Santa Clara, US | 194 | 1117 |
Pandev, Stilian Ivanov | Santa Clara, US | 54 | 1113 |
Peterlinz, Kevin | Fremont, US | 15 | 450 |
Sapiens, Noam | Cupertino, US | 51 | 851 |
Shchegrov, Andrei V | Campbell, US | 92 | 2359 |
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