POLYSILICON FILAMENT BONDING DEVICE USING POLYSILICON FRAGMENTS

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United States of America Patent

SERIAL NO

15322324

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Abstract

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The present invention relates to a polysilicon filament manufacturing device, and more specifically, to a polysilicon filament binding device for manufacturing a polysilicon filament having a desired length by connecting polysilicon fragments cut from damage, etc. The present invention provides a polysilicon filament binding device comprising: a body part having a barrel-shape; a guide part provided inside the body part, guiding incoming polysilicon fragments; and a main light source for heating the binding surfaces of the polysilicon fragments.

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Patent Owner(s)

Patent OwnerAddress
OCI COMPANY LTDSEOUL 04532

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KANG, Byung-Chang Seongnam-si, Gyeonggi-do, KR 39 440
KIM, Chang-Ryol Seongnam-si, Gyeonggi-do, KR 1 0

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