ACTIVE ESTER, THERMOSETTING RESIN COMPOSITION, PREPREG AND LAMINATED BOARD CONTAINING SAME
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United States of America Patent
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Issued Date -
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app pub date -
Sep 21, 2015
filing date -
Apr 1, 2015
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Abstract
The present invention provides an active ester, a thermosetting resin composition, a prepreg and a laminated board containing same. The active ester is a PPO main chain-containing double-ended polyfunctional active ester, and the thermosetting resin composition comprises epoxy resin and the PPO main chain-containing double-ended polyfunctional active ester. The prepreg, laminated board and copper-clad plate prepared from the thermosetting resin composition containing the PPO main chain-containing double-ended polyfunctional active ester have excellent dielectric properties, damp-heat resistance, heat resistance, extremely low water absorption and high bending strength.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
SHENGYI TECHNOLOGY CO LTD | NO 5 GONGYE WEST ROAD SONGSHAN LAKE PARK DONGGUAN CITY GUANGDONG PROVINCE 523808 DONGGUAN CITY GUANGDONG PROVINCE 523808 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
LUO, Cheng | Guangdong, CN | 108 | 335 |
# of filed Patents : 108 Total Citations : 335 | |||
TANG, Guofang | Guangdong, CN | 9 | 14 |
# of filed Patents : 9 Total Citations : 14 |
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- 1 Citation Count
- C08J Class
- 40.10 % this patent is cited more than
- 7 Age
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