WIRING BOARD

Number of patents in Portfolio can not be more than 2000

United States of America Patent

SERIAL NO

15663962

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A wiring board includes an insulating layer including a first insulating film provided with a first surface and a second surface that is opposite to the first surface, and composed of only resin, and a second insulating film provided with a first surface and a second surface that is opposite to the first surface, including a reinforcing member and resin, in which the reinforcing member is impregnated with the resin, and stacked on the first surface of the first insulating film such that the second surface of the second insulating film contacts the first surface of the first insulating film and the second surface of the first insulating film is exposed outside; and a first wiring layer embedded in the first insulating film, a predetermined surface of the first wiring layer being exposed from the second surface of the first insulating film.

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Patent Owner(s)

Patent OwnerAddress
SHINKO ELECTRIC INDUSTRIES CO LTDNAGANO

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
FUKASE, Katsuya Nagano, JP 44 795
KOBAYASHI, Kazuhiro Nagano, JP 240 3020
MIYAIRI, Ken Nagano, JP 7 42
OSHIMA, Kazuhiro Nagano, JP 34 270
YANAGISAWA, Hiroharu Nagano, JP 10 39

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