Electronic component, electronic component mounting substrate, and electronic component mounting method to facilitate positional alignment between the electronic component and the mounting substrate
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United States of America Patent
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Aug 25, 2020
Grant Date -
Feb 15, 2018
app pub date -
Jan 27, 2016
filing date -
Mar 10, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic component mounting substrate 10A is configured of an electronic component 20, and a mounting substrate 10 mounting the electronic component 20 thereon, in which concave parts 24 are formed on a mounting surface 23 of the electronic component 20 opposite to the mounting substrate 10, a connection part 39 is exposed at the bottom of the concave part 24, and electronic component attachment parts 12 provided on the mounting substrate 10 are soldered to the connection parts 39 provided in the electronic component 20.
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