Binary Ag—Cu amorphous thin-films for electronic applications
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United States of America Patent
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Nov 3, 2020
Grant Date -
Feb 15, 2018
app pub date -
Aug 14, 2017
filing date -
Aug 12, 2016
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Abstract
An interconnect and a method of making an interconnect between one or more features on a substrate comprises: sputtering a noble metal-copper eutectic thin film under controlled power on an oxide grown or deposited on a substrate; and forming an amorphous alloy structure from the noble metal-copper eutectic thin film in the shape of the interconnect and the interconnect comprising no grain or grain boundaries without temperature sensitive resistivity.
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