COMPLEX OF LAMELLAR INORGANIC COMPOUND AND ORGANIC COMPOUND AND METHOD OF PRODUCING THEREOF, DELAMINATED LAMELLAR INORGANIC COMPOUND AND METHOD OF PRODUCING THEREOF, INSULATING RESIN COMPOSITION, RESIN SHEET, INSULATOR, RESIN SHEET CURED PRODUCT, AND HEAT DISSIPATING MEMBER
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United States of America Patent
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Mar 3, 2016
filing date -
Mar 5, 2015
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Abstract
A method of producing a complex of a lamellar inorganic compound and an organic compound includes: heat-treating a particular non-swelling lamellar inorganic compound within a pyrolysis temperature range of the non-swelling lamellar inorganic compound; and intercalating an organic compound into the non-swelling lamellar inorganic compound in a dispersion liquid in which the heat-treated non-swelling lamellar inorganic compound is dispersed in a medium, thereby inserting the organic compound into an interlamellar space of the non-swelling lamellar inorganic compound.
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International Classification(s)
- C08J:WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTE....
- C09K:MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED ....
- C01B:NON-METALLIC ELEMENTS; COMPOUNDS THEREOF
- C07C:ACYCLIC OR CARBOCYCLIC COMPOUNDS
- H01B:CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATER....
- C08K:USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUB....
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
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