Connection verification technique

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United States of America Patent

PATENT NO 10717141
APP PUB NO 20180043450A1
SERIAL NO

15796173

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Abstract

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Some embodiments of the present invention are generally directed to testing connections of a memory device to a circuit board or other device. In one embodiment, a memory device that is configured to facilitate continuity testing between the device and a printed circuit board or other device is disclosed. The memory device includes a substrate and two connection pads that are electrically coupled to one another via a test path. A system and method for testing the connections between a memory device and a circuit board or other device are also disclosed, as are additional techniques for detecting excess temperature and enabling special functionalities using multi-stage connection pads.

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Patent Owner(s)

Patent OwnerAddress
MICRON TECHNOLOGY INCBOISE ID 83707

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kinsley, Thomas Boise, US 4 16

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