MICROELECTRONIC PACKAGES AND ASSEMBLIES WITH REPEATERS
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United States of America Patent
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Aug 3, 2016
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Aug 3, 2016
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A microelectronic assembly includes a circuit panel having a plurality of first contacts at a major surface thereof. One or more microelectronic packages comprise a plurality of microelectronic elements, the one or more packages having terminals electrically coupled with the first contacts, wherein each package includes at least one microelectronic element having a face, and element contacts at the face which are electrically coupled with the plurality of terminals. A repeater (redriver or retimer) assembly is configured to condition one or more signals received from a memory channel control element including one or more signals selected from: an address signal, a command signal, or a data signal, such that the plurality of the microelectronic elements are coupled to the at least one repeater assembly to receive the conditioned signals.
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