LEAD FRAME AND METHOD FOR MANUFACTURING SAME
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United States of America Patent
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N/A
Issued Date -
N/A
app pub date -
Oct 17, 2017
filing date -
Jul 24, 2015
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
Provided is a lead frame including: one or more solder bonding regions containing copper material or copper plating; and a molding resin adhesion region containing a copper oxide film. The solder bonding regions are exposed on a surface of the lead frame. Further, provided is a lead frame manufacturing method including: forming a resist film in a molding resin adhesion region that is included in a surface of a lead frame member made of copper, or that is included in a surface of a copper-plated lead frame member; forming a plating film by performing a metal plating process on one or more solder bonding regions included in the surface of the lead frame member; removing the resist film; and forming a copper oxide film by oxidizing the molding resin adhesion region.
First Claim
Other Claims data not available