MANUFACTURING METHOD FOR JUNCTION, MANUFACTURING METHOD FOR SUBSTRATE FOR POWER MODULE WITH HEAT SINK, AND MANUFACTURING METHOD FOR HEAT SINK
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United States of America Patent
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Mar 2, 2016
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Mar 11, 2015
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A method of manufacturing a bonded body is provided in which a copper member (13B) formed from copper or a copper alloy, and an aluminum member (31) formed from an aluminum alloy in which a Si concentration is set in a range of 1 mass % to 25 mass % are bonded to each other. In the aluminum member before the bonding, D90 of an equivalent circle diameter of a Si phase at a bonding surface with the copper member is set in a range of 1 μm to 8 μm, and the aluminum member and the copper member are subjected to solid-phase diffusion bonding.
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