APPARATUS FOR PROCESSING WAFER-SHAPED ARTICLES
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United States of America Patent
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Issued Date -
Feb 8, 2018
app pub date -
Aug 5, 2016
filing date -
Aug 5, 2016
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Abstract
An apparatus for processing wafer-shaped articles comprises a rotary chuck having a series of contact elements surrounding a wafer-shaped article when mounted on the rotary chuck. A non-rotating plate is positioned interiorly of the series of contact elements. The plate includes a gas supply that is configured to supply gas so as to support a wafer-shaped article without contacting the non-rotating plate according to the Bernoulli principle.
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