Electrostatic chuck and wafer processing apparatus
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United States of America Patent
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Jul 14, 2020
Grant Date -
Feb 8, 2018
app pub date -
Oct 19, 2017
filing date -
Apr 21, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate including a sealing ring provided at a peripheral edge portion of the ceramic dielectric substrate, and an electrode layer including a plurality of electrode components. An outer perimeter of the ceramic dielectric substrate is provided to cause a spacing between the outer perimeter of the ceramic dielectric substrate and an outer perimeter of the electrode layer to be uniform. The spacing between the outer perimeter of the electrode layer and the outer perimeter of the ceramic dielectric substrate is narrower than a spacing of the electrode components. A width of the sealing ring is not less than 0.3 millimeters and not more than 3 millimeters. A width where the electrode layer overlaps the sealing ring is not less than −0.7 millimeters and not more than 2 millimeters.
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