POLISHING PAD, POLISHING APPARATUS AND METHOD FOR MANUFACTURING POLISHING PAD
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Aug 1, 2017
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Aug 5, 2016
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The present invention relates to a polishing pad with improved slurry retention capacity, which includes a polishing layer. The polishing layer includes an elastomer main body and a plurality of titanium dioxide nanowires. Each of the titanium dioxide nanowires is independent and is distributed evenly and randomly in the elastomer main body. The present invention further provides a polishing apparatus and a method for manufacturing the polishing pad.
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