PRINTED CIRCUIT BOARD AND SEMICONDUCTOR MEMORY DEVICE INCLUDING THE SAME

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United States of America Patent

SERIAL NO

15428292

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Abstract

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A semiconductor memory device including a case including an upper case, a lower case, support structures extending from the lower case to the upper case, a printed circuit board (PCB) in the case and supported by the support structures, a leaf spring on a lower surface of the PCB, the leaf spring seated on support surfaces of the support structures, and a solder layer between the PCB and the leaf spring, the solder layer coupling the PCB with the leaf spring may be provided.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDGYEONGGI DO KOREA SUWON

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Woo, Jung-hyun Hwaseong-si, KR 3 24

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Patent Citation Ranking

  • 3 Citation Count
  • F16B Class
  • 36.81 % this patent is cited more than
  • 7 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges2193581801 - 1011 - 200100200300255075125150175225250275325350375400

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