Multilayer capacitor with via electrodes interconnecting internal electrodes and board having the same
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United States of America Patent
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Sep 11, 2018
Grant Date -
Feb 1, 2018
app pub date -
May 10, 2017
filing date -
Jul 27, 2016
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Abstract
A multilayer capacitor includes a capacitor body including dielectric layers and a plurality of first and second internal electrodes alternately disposed with one of the dielectric layers interposed between each pair of adjacent first and second internal electrodes. First and second via electrodes penetrate through the plurality of second internal electrodes to thereby be exposed to a first surface of the capacitor body, and are disposed to be spaced apart from each other. First and second external electrodes are disposed on two side surfaces of the capacitor body and connected to opposing ends of the first internal electrodes, respectively. Third and fourth external electrodes are disposed on the first surface of the capacitor body to be spaced apart from each other, and are connected to end portions of the first and second via electrodes, respectively.
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