Electronic device and manufacturing method thereof
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United States of America Patent
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Sep 3, 2019
Grant Date -
Feb 1, 2018
app pub date -
Jul 27, 2017
filing date -
Jul 29, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
According to one embodiment, an electronic device includes a first substrate including a first basement and a first conductive layer, a second substrate including a second basement which is disposed to be apart from the first conductive layer and includes a first surface opposed to the first conductive layer and a second surface opposite to the first surface, and a second conductive layer disposed on the second surface, the second substrate including a first hole passing through the second basement, and a connecting material passing through the first hole to electrically connect the first conductive layer and the second conductive layer, wherein the first hole is shaped as a funnel.
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