PRINTED CIRCUIT BOARD STRUCTURE
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United States of America Patent
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app pub date -
Jul 14, 2017
filing date -
Jul 28, 2016
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Abstract
Provided is a printed circuit board structure that needs minimum manufacturing costs and in which there is little possibility that a solder bridge is formed. The printed circuit board structure is formed with via holes for electrically conductively connecting electrically conductive layers of a printed circuit board, and the via holes include a coated via hole with a land coated with solder resist and a non-coated via hole with a land not coated with solder resist, wherein the coated via hole is arranged in a place of the printed circuit board where a solder bridge or a solder ball is highly likely to be generated, and is electrically connected to at least one of the non-coated via hole in parallel.
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