Camera module and molded circuit board assembly and manufacturing method thereof
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United States of America Patent
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May 19, 2020
Grant Date -
Feb 1, 2018
app pub date -
Dec 21, 2016
filing date -
Aug 1, 2016
priority date (Note) -
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Abstract
A camera module and its molded circuit board assembly and manufacturing method are disclosed, wherein the molded circuit board assembly includes a circuit board and a molded base integrally formed with the circuit board through a molding process. The molded base forms a light window disposed corresponding to a photosensitive element of the camera module, wherein the light window is configured to have a trapezoidal or multi-stair trapezoidal shape cross section which has diameters increasing from bottom to top to facilitate demoulding, so as to prevent damage to the molded base, and to avoid stray light.
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