Recess structure for print deposition process and manufacturing method thereof

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United States of America Patent

PATENT NO 9954170
SERIAL NO

14912928

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Abstract

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The invention provides a recess structure for print deposition process and manufacturing method thereof. By disposing the dam (2) enclosing the recess (3) as comprising at least two stacked branch dam layers, and increasing the contact angle between the inclined inner circumferential surface of recess (3) enclosed by the branch dam layers and ink in a layer-by-layer manner, to limit height the ink able to climb on the inclined inner circumferential surface of the recess (3), the invention can improve the thickness uniformity of the organic functional layers printed in the recess and the photoelectric properties of organic functional layers. The recess (3) fabricated by the manufacturing method can limit height the ink able to climb on inclined inner circumferential surface of the recess (3) to improve the thickness uniformity of the organic functional layers printed in the recess and the photoelectric properties of organic functional layers.

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Patent Owner(s)

Patent OwnerAddress
SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTDNO 9-2 TANGMING RD GUANGMING NEW DISTRICT SHENZHEN GUANGDONG 518132

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Liu, Yawei Shenzhen, CN 90 363
Wu, Tsungyuan Shenzhen, CN 12 19

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