Method of manufacturing light-emitting device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Jul 17, 2018
Grant Date -
Feb 1, 2018
app pub date -
Jun 14, 2017
filing date -
Jul 29, 2016
priority date (Note) -
In Force
status (Latency Note)
Importance
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US Family Size
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Non-US Coverage
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Abstract
A method of manufacturing a light-emitting device that includes a circuit board with p- and n-electrodes formed on a surface of a substrate and a light-emitting element connected to the p- and n-electrodes of the circuit board via a conductor member. The method includes forming two protrusions facing each other on both sides of a gap between the p- and n-electrodes of the circuit board, and dispensing a underfill at a position on an opposite side to the light-emitting element with respect to the two protrusions, allowing the dispensed underfill to flow toward the light-emitting element by a capillary action through the gap between the p- and n-electrodes of the circuit board while contacting the protrusions, and filling, by the capillary action, a gap between the circuit board and the light-emitting element with the underfill reaching a bottom of the light-emitting element.
First Claim
Other Claims data not available
Family
| Country | kind | publication No. | Filing Date |
|---|---|---|---|
| JP | B2 | JP6699432 | Jul 29, 2016 |
International Classification(s)
- 2017 Application Filing Year
- H01L Class
- 30754 Applications Filed
- 25260 Patents Issued To-Date
- 82.14 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 2 Citation Count
- H01L Class
- 23.71 % this patent is cited more than
- 7 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jan 17, 2026 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jan 17, 2030 |
