PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
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United States of America Patent
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app pub date -
Oct 3, 2016
filing date -
Jul 29, 2016
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Abstract
An embodiment is a structure including a first die, a molding compound at least laterally encapsulating the first die, a first redistribution structure including metallization patterns extending over the first die and the molding compound, a first conductive connector comprising a solder ball and an under bump metallization coupled to the first redistribution structure, and an integrated passive device bonded to a first metallization pattern in the first redistribution structure with a micro bump bonding joint, the integrated passive device being adjacent the first conductive connector.
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