Semiconductor package structure
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United States of America Patent
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Dec 25, 2018
Grant Date -
Feb 1, 2018
app pub date -
Jul 29, 2016
filing date -
Jul 29, 2016
priority date (Note) -
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Abstract
A semiconductor package structure includes an encapsulant, a first chip, a second chip, a first redistribution layer and a second redistribution layer. The encapsulant has a first surface and a second surface opposite to each other. The first chip is in the encapsulant, wherein the first chip includes a plurality of contact pads exposed from the first surface of the encapsulant. The second chip is in the encapsulant, wherein second chip includes a plurality of contact pads exposed from the second surface of the encapsulant. The first redistribution layer is over the first surface of the encapsulant and electrically connected to the contact pads of the first chip. The second redistribution layer is over the second surface of the encapsulant and electrically connected to the contact pads of the second chip.
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