Electronic device having an under-fill element, a mounting method of the same, and a method of manufacturing a display apparatus having the electronic device
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United States of America Patent
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Apr 30, 2019
Grant Date -
Feb 1, 2018
app pub date -
Jul 27, 2017
filing date -
Aug 1, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
A mounting method of an electronic device includes providing an electronic device which includes a semiconductor chip body including an upper surface, a lower surface opposite to the upper surface, and side surfaces connecting the upper surface and the lower surface, a plurality of bumps disposed on the lower surface, and an under-fill element disposed on at least one side surface. The method further includes mounting the electronic device on a printed circuit board including connecting pads formed thereon. The bumps of the semiconductor chip body are connected to the connecting pads. The method additionally includes heating the under-fill element to a predetermined temperature to form an under-fill layer between the lower surface of the semiconductor chip body and the printed circuit board.
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