Solder material for semiconductor device
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United States of America Patent
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Jul 28, 2020
Grant Date -
Feb 1, 2018
app pub date -
Aug 28, 2017
filing date -
Sep 17, 2015
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Abstract
To provide a lead-free solder the heat resistance temperature of which is high and thermal conductive property of which are not changed in a high temperature range. A semiconductor device of the present invention includes a solder material containing more than 5.0% by mass and 10.0% by mass or less of Sb and 2.0 to 4.0% by mass of Ag, and the remainder consisting of Sn and inevitable impurities, and a bonding layer including the solder material, which is formed between a semiconductor element and a substrate electrode or a lead frame.
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