Heterogeneous ball pattern package
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United States of America Patent
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Jan 8, 2019
Grant Date -
Feb 1, 2018
app pub date -
Aug 1, 2016
filing date -
Aug 1, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
Methods and apparatus are described for strategically arranging conductive elements (e.g., solder balls) of an integrated circuit (IC) package (and the corresponding conductive pads of a circuit board for electrical connection with the IC package) using a plurality of different pitches. One example integrated circuit (IC) package generally includes an integrated circuit die and an arrangement of electrically conductive elements coupled to the integrated circuit die. In at least one region of the arrangement, the conductive elements are disposed with a first pitch in a first dimension of the arrangement and with a second pitch in a second dimension of the arrangement, and the second pitch is different from the first pitch. The pitch of a given region may be based on mechanical, PCB routing, and/or signal integrity considerations.
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