Method for manufacturing semiconductor structure
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United States of America Patent
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Apr 23, 2019
Grant Date -
Feb 1, 2018
app pub date -
Oct 6, 2017
filing date -
Nov 16, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
A method of manufacturing a semiconductor structure include: providing a die including a die pad disposed over the die; disposing a conductive member over the die pad of the die; forming a molding surrounding the die and the conductive member; disposing a dielectric layer over the molding, the die and the conductive member; and forming an interconnect structure including a land portion and a plurality of via portions. The land portion is disposed over the dielectric layer, the plurality of via portions are disposed over the conductive member and protruded from the land portion to the conductive member through the dielectric layer, and each of the plurality of via portions at least partially contacts with the conductive member.
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