Integrated circuit structure having crown-shaped semiconductor strips and recesses in the substrate from etched dummy fins
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United States of America Patent
Stats
-
May 21, 2019
Grant Date -
Feb 1, 2018
app pub date -
Jan 5, 2017
filing date -
Jul 29, 2016
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An integrated circuit structure includes a semiconductor substrate having a plurality of semiconductor strips, a first recess being formed by two adjacent semiconductor strips among the plurality of semiconductor strips, a second recess being formed within the first recess, and an isolation region being provided in the first recess and the second recess. The second recess has a lower depth than the first recess.
First Claim
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International Classification(s)
- 2017 Application Filing Year
- H01L Class
- 30754 Applications Filed
- 25260 Patents Issued To-Date
- 82.14 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 4 Citation Count
- H01L Class
- 32.24 % this patent is cited more than
- 6 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Nov 21, 2026 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Nov 21, 2030 |
