Semiconductor wafer and method of reducing wafer thickness with asymmetric edge support ring encompassing wafer scribe mark
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United States of America Patent
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Oct 23, 2018
Grant Date -
Feb 1, 2018
app pub date -
Jul 29, 2016
filing date -
Jul 29, 2016
priority date (Note) -
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Abstract
A semiconductor wafer has a base material with a first thickness and first and second surfaces. A wafer scribe mark is disposed on the first surface of the base material. A portion of an interior region of the second surface of the base material is removed to a second thickness less than the first thickness, while leaving an edge support ring of the base material of the first thickness and an asymmetric width around the semiconductor wafer. The second thickness of the base material is less than 75 micrometers. The wafer scribe mark is disposed within the edge support ring. The removed portion of the interior region of the second surface of the base material is vertically offset from the wafer scribe mark. A width of the edge support ring is wider to encompass the wafer scribe mark and narrower elsewhere around the semiconductor wafer.
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