Electronic circuit package
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United States of America Patent
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Apr 23, 2019
Grant Date -
Feb 1, 2018
app pub date -
Jul 5, 2017
filing date -
Jul 26, 2016
priority date (Note) -
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Abstract
Disclosed herein is an electronic circuit package includes a substrate having a power supply pattern, a first electronic component mounted on a first region of a front surface of the substrate, a mold resin that covers the front surface of the substrate so as to embed the first electronic component therein, and a laminated film covering an upper surface of the mold resin, the laminated film including a magnetic film and a first metal film. The first metal film is connected to the power supply pattern. The magnetic film is selectively thick on the first region.
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