Self-shielded die having electromagnetic shielding on die surfaces
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United States of America Patent
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Mar 20, 2018
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N/A
app pub date -
Jul 30, 2016
filing date -
Jul 30, 2016
priority date (Note) -
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Abstract
A self-shielded die includes a substrate, an electronic device attached to the substrate, one or more electrical pads disposed on a bottom surface of the substrate, and an electromagnetic interference (EMI) shield formed of at least one electrically conductive material and connected to ground. At least one of the one or more electrical pads is electrically connected to the electronic device. The EMI shield includes a top shield layer, disposed directly on and substantially completely covering a top surface of the substrate opposite the bottom surface of the substrate, and side shield layers substantially completely covering all sides of the substrate, extending between the top surface of the substrate and the bottom surface of the substrate.
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