Interconnect structure having power rail structure and related method
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United States of America Patent
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Jun 12, 2018
Issued Date -
Feb 1, 2018
app pub date -
Jul 27, 2016
filing date -
Jul 27, 2016
priority date (Note) -
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Abstract
Disclosed herein is an integrated circuit (IC) including a first metal layer running in a first direction, a second metal layer running in a second direction perpendicular to the first direction, the second metal layer above the first metal layer and a third metal layer running in the first direction above the second metal layer. A viabar electrically connects the first metal layer to the third metal layer, the viabar running in the first direction wherein the viabar vertically extends from the first metal layer to the third metal layer. A method of manufacturing the IC is provided.
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