Double-encapsulated power semiconductor module and method for producing the same
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United States of America Patent
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Nov 20, 2018
Grant Date -
Feb 1, 2018
app pub date -
Jul 26, 2017
filing date -
Jul 27, 2016
priority date (Note) -
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Abstract
One aspect relates to a power semiconductor module. The module includes a module housing, a substrate, and a semiconductor chip attached to the substrate. The semiconductor chip is disposed in the module housing. A dielectric first encapsulation is disposed in the module housing, in physical contact with both the semiconductor chip and the substrate and has a first modulus of elasticity. A dielectric second encapsulation is disposed in the module housing and has a second modulus of elasticity. The first encapsulation is a polymer and disposed between the substrate and the second encapsulation. The semiconductor chip is disposed between the first encapsulation and the substrate. Further, the first modulus of elasticity is greater than the second modulus of elasticity.
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