Semiconductor device manufacturing method
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United States of America Patent
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Jul 5, 2022
Grant Date -
Feb 1, 2018
app pub date -
Apr 20, 2015
filing date -
Apr 20, 2015
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Abstract
A semiconductor device manufacturing method includes thinning a wafer to form a wafer having an annular protruding portion on a peripheral portion thereof by grinding a central portion of a back surface of the wafer and then performing wet etching on the back surface of the wafer, forming a backside electrode on the back surface of the wafer, performing plating to evenly form a metal film on a portion of the backside electrode on the annular protruding portion, attaching a dicing tape to the metal film, and dicing the wafer having the dicing tape attached thereto.
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