Manufacturing method of semiconductor device
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United States of America Patent
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May 15, 2018
Issued Date -
Feb 1, 2018
app pub date -
Jun 24, 2015
filing date -
Jun 24, 2015
priority date (Note) -
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Abstract
The reliability of a semiconductor device is improved. In a manufacturing method of a semiconductor device, when resin enters a ditch formed on a lower surface of a chip mounting portion by a process of forming a sealing body made of the resin, the resin embedded in the ditch is removed by a process of cleaning the lower surface of the chip mounting portion, and a plating film is formed also on an inner wall of the ditch in a process of forming the plating film on the lower surface of the chip mounting portion.
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