PERFORMING DECOUPLED PLASMA FLUORINATION TO REDUCE INTERFACIAL DEFECTS IN FILM STACK
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Jan 27, 2017
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Jul 29, 2016
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Embodiments of the present disclosure generally relate to methods for forming a dielectric material on a substrate, and more specifically, to methods for forming a high-k dielectric layer in an electronic device. In one embodiment, the method includes depositing a high-k dielectric layer on a substrate and fluorinating the deposited high-k dielectric layer. The fluorinating the high-k dielectric layer includes exposing the high-k dielectric layer to a fluorine containing plasma at temperature between about 200 degrees Celsius and about 550 degrees Celsius. At this temperature range, the fluorine radicals form fluorine bonds at the interface between the high-k dielectric layer and the substrate without etching any materials.
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