Filling Method and Filling Apparatus
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United States of America Patent
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app pub date -
Jan 27, 2016
filing date -
Feb 19, 2015
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Abstract
This filling method includes a step of depressurizing a processing chamber, a step of bringing a filling material into contact with a surface of a wafer, a step of filling by differential pressure fine spaces of the wafer with the filling material by applying a pressure onto an entire surface of the filling material on a side opposite to the wafer, and a step of baking the filling material throughout the wafer.
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