INDUCTOR HAVING VIA CONNECTION LAYER

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United States of America Patent

SERIAL NO

15457475

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Abstract

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An inductor includes a body including a coil part therein. The coil part includes a first coil layer electrically connected to a first via; a second coil layer disposed below the first coil layer and electrically connected to a second via displaced laterally from that of the first via; and a via connection layer disposed between the first coil layer and the second coil layer and electrically connected to the first and second vias.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRO-MECHANICS CO LTDMAEYOUNG-RO 150 (MAETAN-DONG) YOUNGTONG-GU SUWON-SI GYEONGGI-DO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AHN, Young Ghyu Suwon-si, KR 216 1680
LEE, Dong Hwan Suwon-si, KR 182 965
YOON, Chan Suwon-si, KR 102 450

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