Electronic device
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United States of America Patent
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Apr 2, 2019
Grant Date -
Feb 1, 2018
app pub date -
Jul 25, 2017
filing date -
Jul 29, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
According to one embodiment, an electronic device including a first substrate which includes a first basement, a first conductive layer, and a second conductive layer in contact with the first conductive layer, a second substrate which includes a second basement opposed to the first conductive layer and separated from the first conductive layer, a third conductive layer, and a first hole penetrating the second substrate, and a connecting material which electrically connects the second conductive layer and the third conductive layer via the first hole and directly contacts the second conductive layer.
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