LIQUID PROCESSING APPARATUS AND LIQUID PROCESSING METHOD

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United States of America Patent

APP PUB NO 20180032092A1
SERIAL NO

15659750

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A liquid processing apparatus includes: a substrate processing unit; a supply line that supplies the fluid to the substrate processing unit; a flow meter that measures a flow rate of the fluid flowing through the supply line; a flow rate adjustment mechanism that adjusts the flow rate of the fluid flowing through the supply line; and a controller that control the flow rate adjustment mechanism based on a measurement result of the flow meter. The controller receives the measurement result at a first cycle. When the measurement result of the flow meter indicates that the flow rate of the fluid flowing through the supply line is included in a preset range, the controller causes the flow rate adjustment mechanism to adjust the flow rate of the fluid flowing through the supply line at a cycle having a time interval longer than a time interval of the first cycle.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITEDTOKYO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Komiya, Hiroshi Kumamoto, JP 25 133
Ogura, Kouji Kumamoto, JP 15 14
Satake, Keigo Kumamoto, JP 27 106

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