Method of manufacturing structure and method of manufacturing liquid ejection head

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United States of America Patent

PATENT NO 10303062
APP PUB NO 20180031980A1
SERIAL NO

15660632

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Abstract

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A method of manufacturing a structure including a substrate and a photosensitive resin layer provided on the substrate includes irradiating a region of the photosensitive resin layer with light in a state where a layer is provided on a surface of the substrate, the region being located above a space surrounded by the substrate and the photosensitive resin layer, and the surface facing the space, and removing a portion of the photosensitive resin layer located above the space to form a hole, wherein the provided layer has a reflectance of 40% or less with respect to the light.

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Patent Owner(s)

Patent OwnerAddress
CANON KABUSHIKI KAISHATOKYO TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ishikawa, Tetsushi Tokyo, JP 32 95
Otsuka, Manabu Kawasaki, JP 36 194
Tominaga, Yasuaki Kawasaki, JP 15 71

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