Substrate loading in microlithography
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United States of America Patent
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Jul 17, 2018
Grant Date -
Feb 1, 2018
app pub date -
Jun 2, 2017
filing date -
Jul 29, 2016
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Abstract
Methods, systems, and apparatus for the loading and unloading of substrates, such as semiconductor wafers, involving microlithography and similar nano-fabrication techniques. The system includes two or more pedestals; a substrate chuck including two or more channels; a turntable having a top surface and a first end positioned opposite a second end, each of the first and second ends including a respective opening, each opening including two or more cutouts and two or more tabs, the turntable rotatable between first and second positions and an actuator system to adjust distances between the turntable and the substrate chuck and between the turntable and the pedestals.
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