Photosensitive resin composition, method for manufacturing cured resin film, and semiconductor device
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United States of America Patent
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Jul 30, 2019
Grant Date -
Feb 1, 2018
app pub date -
Feb 9, 2016
filing date -
Mar 4, 2015
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Abstract
Provided is a photosensitive resin composition containing: one or more kinds of alkali-soluble resins selected from a polyimide, a polybenzoxazole, a polyimide precursor, a polybenzoxazole precursor, and a copolymer formed of two or more polymers selected from the preceding substances; and a photosensitizer. The photosensitive resin composition further contains a compound represented by general formula (1). Even when a cured film is fired at low temperature, the photosensitive resin composition exhibits superior adhesion properties with metallic materials, particularly copper, and also exhibits high chemical resistance.
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