Photosensitive resin composition, method for manufacturing cured resin film, and semiconductor device
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United States of America Patent
Stats
-
Jul 30, 2019
Grant Date -
Feb 1, 2018
app pub date -
Feb 9, 2016
filing date -
Mar 4, 2015
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Provided is a photosensitive resin composition containing: one or more kinds of alkali-soluble resins selected from a polyimide, a polybenzoxazole, a polyimide precursor, a polybenzoxazole precursor, and a copolymer formed of two or more polymers selected from the preceding substances; and a photosensitizer. The photosensitive resin composition further contains a compound represented by general formula (1). Even when a cured film is fired at low temperature, the photosensitive resin composition exhibits superior adhesion properties with metallic materials, particularly copper, and also exhibits high chemical resistance.
First Claim
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International Classification(s)
- 2016 Application Filing Year
- H01L Class
- 27971 Applications Filed
- 23507 Patents Issued To-Date
- 84.05 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 6 Age
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|---|---|---|---|---|
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