Electronic apparatus and method for manufacturing the same
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United States of America Patent
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Sep 3, 2019
Grant Date -
Feb 1, 2018
app pub date -
Jul 27, 2017
filing date -
Jul 29, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
According to one embodiment, an electronic apparatus includes a first substrate, a second substrate, and a connecting material. The second substrate includes a second basement and a second conductive layer. The second basement has a third surface opposed to the first conductive layer and a fourth surface and is spaced apart from the first conductive layer. The second substrate has a first hole penetrating the second basement. The first substrate has a second hole. A third opening of the second hole is smaller than a first opening of the first hole. A connecting material connects the first conductive layer and the second conductive layer via the first hole.
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