Method of manufacturing electronic device
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United States of America Patent
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Aug 28, 2018
Grant Date -
Feb 1, 2018
app pub date -
Jul 28, 2017
filing date -
Jul 29, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
According to one embodiment, a method of manufacturing an electronic device, includes preparing a first substrate including a first basement and a first conductive layer, and a second substrate includes a second basement and a second conductive layer, opposing the first conductive layer and spaced from the first conductive layer, providing a protection layer on the second substrate, forming a first hole penetrating the second substrate by irradiating the second substrate with a laser beam in a position overlapping the protection layer, removing the protection layer and forming a connecting material electrically connecting the first conductive layer and the second conductive layer to each other via the first hole after removing the protection layer.
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