Ultrasonic imaging with acoustic resonant cavity

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United States of America Patent

PATENT NO 10274590
APP PUB NO 20180031686A1
SERIAL NO

15782750

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Techniques describe structures and methods for generating larger output signals and improving image quality of ultrasonic sensors by inclusion of an acoustic cavity in the sensor stack. In some embodiments, an ultrasonic sensor unit may be tuned during manufacturing or during a provisioning phase to work with different thicknesses and materials. In some embodiments, a standing wave signal may be generated using an acoustic cavity in the ultrasonic sensor unit for capturing an ultrasonic image of an object placed on a sensor surface. In some implementations, the ultrasonic sensor may include an ultrasonic transmitter, a piezoelectric receiver, a thin film transistor (TFT) layer and a TFT substrate positioned between the transmitter and the receiver, one or more adhesive layers, and optional cover materials and coatings. The thickness, density and speed of sound of the sensor materials and associated adhesive attachment layers may be used to attain the desired acoustic cavity and improved performance.

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Patent Owner(s)

Patent OwnerAddress
QUALCOMM INCORPORATED5775 MOREHOUSE DRIVE SAN DIEGO CA 92121-1714

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Burns, David William San Jose, US 90 4078
Chuei, Nao Sugawara San Mateo, US 5 235
Djordjev, Kostadin Dimitrov Los Gatos, US 71 1162
Hinger, Ashish Sunnyvale, US 13 523
Kuo, Nai-Kuei Los Gatos, US 9 689
Ranganathan, Ranjith San Jose, US 3 225

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